Systems and methods for reconditioning implants in situ

ABSTRACT

A system for reconditioning a dental implant in situ has a buffer member and a drive member. The buffer member is operable in an open configuration in which the buffer member may be placed over a portion of the implant and a closed configuration in which the buffer member is in contact with the portion of the implant. The drive member is adapted to engage the buffer member such that rotation of the drive member is transferred to the buffer member. Rotation of the drive member with the drive member engaged the buffer member and the buffer member in the closed configuration causes rotation of the buffer member such that the buffer member abrades at least a portion of the surface of the implant.

RELATED APPLICATIONS

This application U.S. patent application Ser. No. 13/194,590 filed Jul.29, 2011, claims priority benefit of U.S. Provisional Patent ApplicationSer. No. 61/368,784 filed Jul. 29, 2010, the contents of which areincorporated herein by reference.

TECHNICAL FIELD

The present invention relates to prosthodontic methods and apparatusand, more specifically, to such methods and apparatus that simplify themaking of dental impressions employed to fabricate a restorative toothprosthesis.

BACKGROUND

Many systems and methods are currently available for replacing lost,removed, or diseased teeth. These systems and methods comprise thefollowing basic steps. First, an implant is threaded into a cavityformed in the patient's jaw at the location of a lost tooth. The implantis then allowed to osseointegrate with the jaw bone. A technician willthen fabricate a prosthetic tooth on an abutment member. The abutmentmember is then attached to the implant to mount the prosthetic tooth atits appropriate location. In this context, the abutment member forms thestructural attachment between the prosthetic tooth and the implant, andthe prosthetic tooth functionally and aesthetically replaces the exposedportion of the lost tooth.

It should be clear that this basic process can be employed whenreplacing a plurality of teeth as well as when replacing a single tooth.In the following discussion, the present invention is described in thecontext of a single tooth, but the principles of the present inventionare equally applicable to the situations in which more than one toothhas been replaced.

In certain situations, conditions within the mouth result in an adversechange in the condition of the implant, the abutment member, and/ormouth around the implant and abutment member. When such conditions mightbe present, the need exists for systems and methods of reconditioningthe implant and/or abutment member in situ to avoid or reverse suchadverse changes.

SUMMARY

The present invention may be embodied as a system for reconditioning adental implant in situ comprising a buffer member and a drive member.The buffer member is operable in an open configuration in which thebuffer member may be placed over a portion of the implant and a closedconfiguration in which the buffer member is in contact with the portionof the implant. The drive member is adapted to engage the buffer membersuch that rotation of the drive member is transferred to the buffermember. Rotation of the drive member with the drive member engaged thebuffer member and the buffer member in the closed configuration causesrotation of the buffer member such that the buffer member abrades atleast a portion of the surface of the implant.

The present invention may also be embodied as a method of reconditioninga dental implant in situ within a patient's mouth comprising thefollowing steps. An anomaly associated with the dental implant isidentified. At least one of tissue and bone adjacent to the anomaly isremoved to expose at least a portion of the dental implant associatedwith the anomaly. A buffer member in an open configuration and arrangedadjacent to the portion of the dental implant associated with theanomaly. The buffer member is arranged in a closed configuration. Thebuffer member is rotated to abrade the portion of the dental implantassociated with the anomaly.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of a first example reconditioning system ofthe present invention;

FIG. 2A is a section view of a first example buffer member of the firstexample reconditioning system in an open configuration;

FIG. 2B is a section view of the first example buffer member in a closedconfiguration;

FIG. 2C is a bottom plan view of the first example buffer member in theopen configuration;

FIG. 2D is a top plan view of the first example buffer member in theclosed configuration;

FIG. 2E is a bottom plan view of the first example buffer member in theclosed configuration;

FIG. 3A is a section view of a first example drive member of the firstexample reconditioning system;

FIG. 3B is a bottom plan view of the first example drive member;

FIG. 4A is a section view of a first example sleeve member of the firstexample reconditioning system;

FIG. 4B is a bottom plan view of the first example sleeve member;

FIG. 5A is a section view of a first example guide member used by thefirst example reconditioning system;

FIG. 5B is a top plan view of the first example guide member;

FIG. 6 is an exploded view of a second example reconditioning system ofthe present invention;

FIG. 7A is a section view of a second example buffer member of thesecond example reconditioning system in an open configuration;

FIG. 7B is a somewhat schematic section view of the second examplebuffer member in an open configuration;

FIG. 7C is a bottom plan view of the second example buffer member in theclosed configuration;

FIG. 7D is a top plan view of the second example buffer member in theclosed configuration;

FIG. 8A is a section view of a second example drive member of the firstexample reconditioning system;

FIG. 8B is a bottom plan view of the second example drive member;

FIG. 9A is a section view of a second example sleeve member of thesecond example reconditioning system;

FIG. 9B is a bottom plan view of the second example sleeve member;

FIG. 10 is a side elevation view of a second example guide member of thesecond example reconditioning system;

FIG. 11 is a side elevation view of a third example guide member thatmay be used by the second example reconditioning system in place of thesecond example guide member;

FIG. 12 is a side elevation, partial section view of a first exampletype of implant member in situ;

FIG. 13 is an enlarged view of a portion of FIG. 12 illustrating animplant interface between the implant structure and the patient;

FIG. 14 is an enlarged view similar to that of FIG. 13 illustrating ananomaly at the implant interface;

FIG. 15 is a side elevation, partial section view of illustrating theimplant structure of FIG. 12 prepared for in situ reconditioning;

FIG. 16 is a side elevation, partial section view of illustrating theuse of the first example reconditioning system to recondition the firstexample implant member of FIG. 12 in situ according to the principles ofthe present invention;

FIG. 17 is an enlarged view of a section of FIG. 16 depicting the flowof abrasive slurry around the implant structure when using the firstexample reconditioning system;

FIG. 18 is an enlarged view similar to that of FIGS. 13 and 14 depictingthe first example implant member in a reconditioned state;

FIG. 19 is a side elevation, partial section view illustrating a secondexample type of implant member in situ;

FIG. 20 is a side elevation, partial section view of illustrating theuse of the second example reconditioning system to recondition thesecond example implant member of FIG. 19 in situ according to theprinciples of the present invention; and

FIG. 21 is an exploded view of a third example reconditioning system ofthe present invention.

DETAILED DESCRIPTION I. Introduction

In the following discussion, first, second, and third examplereconditioning systems of the present invention will be described.Example methods of using the first and second example reconditioningsystems will then be presented. Finally, certain variations on thesystems and methods described herein will be presented.

II. First Example Reconditioning System

Referring initially to FIG. 1 of the drawing, depicted therein is afirst example implant reconditioning system 20 constructed in accordancewith, and embodying, the principles of the present invention. The firstexample system 20 comprises a buffer member 22, a drive member 24, asleeve member 26, and a guide member 28. The first example implantreconditioning system 20 defines a first system axis A.

In use, the guide member 28 supports the buffer member 22 in a desiredposition relative to an implant to be reconditioned (not shown in FIG.1). The driver member 24 engages the buffer member 22 and rotates thebuffer member 22 relative to the implant. The sleeve member 26 isdisengaged to allow the buffer member 22 to be placed in an openconfiguration in which the buffer member 22 may be arranged in thedesired position; the sleeve member 26 is then placed in an engagedposition to hold the buffer member 22 is a closed configuration aroundthe implant. As the buffer member 22 is held in the closed configurationaround the implant and rotated relative thereto, the buffer member 22causes the implant member to be reconditioned.

FIGS. 2A-2E illustrate that the first example buffer member 22 comprisesa base portion 30 and a plurality (two or more) of fingers 32 anddefines a buffer member axis A₁. A drive boss 40 extends from the baseportion 30 generally along the buffer member axis A₁. As perhaps bestshown in FIG. 2D, the drive boss 40 is longer in a first lateraldirection than in a second lateral dimension; the exact shape of thedrive boss 40 is, however, not critical so long as it functions totransfer torque as described below.

An interior surface 42 of the base portion 30 defines a seat surface 44.The seat surface 44 is generally circular and symmetrically arrangedabout the buffer member axis A₁. An alignment cavity 46 extends inwardlyfrom the interior surface 42 generally along the buffer member axis A₁.The example base portion 30 depicted in FIGS. 2A-2E further comprises abuffer passageway 48 that also generally extends in the direction of thebuffer member axis A₁.

The fingers 32 comprise extension portions 50 and tip portions 52.

Formed on an outer surface 54 of the buffer member 22 are a step surface56 (at the base of the fingers 32) and sleeve detent(s) 58 (on the tipportions 52 of the fingers 32).

The extension portions 50 define first inner surface portions 60, whilethe tip portions 52 define second and third inner surface portions 62and 64. The second surface portions 62 extend between the first andthird inner surface portions 60 and 64 of each of the fingers 32.

As perhaps best shown in FIG. 2B, the extension portions 50 have a firstthickness dimension T 1 and a first length dimension L 1 and the tipportions 52 have a second thickness dimension T 2 and a second and thirdlength dimensions L 2 and L 3. For reasons that will become apparentfrom the following discussion, the relative dimensions of the extensionportions 50 and tip portions 52 are typically selected based on thedimensions of the implant to be reconditioned.

The buffer member 22 is configured such that the fingers 32 can be movedrelative to the buffer member axis A₁ between an open configuration(FIGS. 2A, 2C) and a closed configuration (FIGS. 2B, 2D, and 2E).Typically, the entire buffer member 22 is made of a resilient materialthat can be deformed to move the fingers 32 between the open and closedconfigurations.

As shown in FIG. 2B, with the example buffer member 22 in the closedconfiguration, the first, second, and third inner surface portions 60,62, and 64 are arranged to define substantially contiguous first,second, and third buffer surfaces 60 a, 62 a, and 64 a, and these buffersurfaces 60 a, 62 a, and 64 a define a buffer chamber 66. In addition,the third buffer surface 64 a defines a buffer opening 68. FIG. 2Bfurther illustrates that the buffer chamber 66 is in fluid communicationwith the alignment cavity 46 and that, in turn, the alignment cavity 46is in fluid communication with the buffer passageway 48.

In this closed configuration, the first inner surface portions 60 ofopposing fingers 32 are spaced from each other a distance greater than adistance between the third inner portions 64 of the opposing fingers 32.Also, in this closed configuration the example first and third innersurface portions 60 and 64 are substantially parallel to the buffersystem axis A₁, while the second inner surface portions 62 are angledwith respect to the buffer axis A₁.

Turning now to FIGS. 3A and 3B, depicted therein are details of thefirst example drive member 24 of the first example implantreconditioning system 20. The example drive member 24 comprises anelongate shaft 70 defining a drive axis A₂. The drive member 24 furtherdefines a base cavity 72, a boss cavity 74, and a drive passageway 76.The base cavity 72 and drive passageway 76 are substantiallysymmetrically arranged along the drive axis A₂. Like the drive boss 40,the boss cavity 74 is longer in a first lateral direction than in asecond lateral dimension. Further like the drive boss 40, the exactshape of the boss cavity 74 is not critical. Although the exact shapesof the drive boss 40 and boss cavity 74 are not important, the bosscavity 74 should receive the drive boss 40 such that axial rotation ofthe drive member 24 is efficiently transferred to the buffer member 22as will be described in further detail below.

Turning now to FIGS. 4A and 4B of the drawing, depicted in more detailtherein is the first example sleeve member 26 of the first exampleimplant reconditioning system 20. The sleeve member 26 defines a driveaxis A₃ and an interior wall 80; the interior wall 80 in turn defines asleeve passageway 82. Formed in the interior wall 80 towards one end ofthe sleeve to passageway 82 is a detent groove 84.

FIGS. 5A and 5B depict the guide member 28 of the first example implantreconditioning system 20. The example guide member 28 defines a guideaxis A₄ and comprises a seat portion 90, an alignment portion 92, and ananchor portion 94. Extending through the guide member 28 is a firstguide is passageway 96 and one or more second guide passageways 98. Thefirst guide passageway 96 extends through the alignment portion 92 andis in fluid communication with the second guide passageway(s) 98. Thesecond guide passageway(s) 98 extend through the bottom of the seatportion 90 at an angle with respect to the guide axis A₄.

The seat portion 90 is sized and dimensioned to engage the seat surface44 of the buffer member 22 with the alignment portion 92 received withinthe alignment cavity 46. The example anchor portion 94 is threaded toengage the implant to be reconditioned as will be described in furtherdetail below.

The first example implant reconditioning system 20 is assembledgenerally as follows. The anchor portion 94 of the guide member 28 isengaged with the implant (as will be described in further detail below),and the buffer member 22 is attached to the drive member 24 to form afirst installation unit. The first installation unit is then attached tothe sleeve member 26 to form a second installation unit. The secondinstallation unit is then attached to the guide member 28 supported bythe implant.

To attach the buffer member 22 to the drive member 24, the buffer member22 and drive member 24 are then arranged such that the buffer axis A₁and drive axis A₂ are aligned with each other. The buffer member 22 isthen displaced relative to the drive member 24 such that the baseportion 30 of the buffer member 22 is inserted into the base cavity 72of the drive member 24. When the base portion 30 is fully receivedwithin the base cavity 72, the drive boss 40 is also received within theboss cavity 74. And when the drive boss 40 is received in the bosscavity 74, the drive passageway 76 is substantially aligned with thebuffer passageway 48. Fluid flow may thus flow between a distal end 24 aof the drive member 24 and the alignment cavity 46. Additionally, aproximal end 24 b of the drive member 24 engages the step surface 56when the base portion 30 is completely received within the base cavity72. At this point, the first installation unit is formed.

After the buffer member 22 has been attached to the drive member 24, thesleeve member 26 is arranged such that the sleeve axis A₃ is alignedwith the buffer axis A₁ and the drive axis A₂. The buffer member 22 anddrive member 24 are then displaced such that the distal end 24 a of thedrive member 24 enters the sleeve passageway 82. The buffer member 22and the drive member 24 are inserted through the sleeve passageway 82until the distal end 24 a exits the passageway 82 and the detent groove84 is generally aligned with the base portion 30 of the buffer member22. At this point, the second installation unit has been formed.

The second installation unit is initially in a pre-installationconfiguration in which the buffer member 22 is in the openconfiguration. By displacing the sleeve member 26 relative to the buffermember 22 such that the sleeve detent(s) 58 enter the detent groove 84,the second installation unit may be placed into an installationconfiguration.

The buffer member 22, drive member 24, and sleeve member 26 forming thesecond installation unit in the pre-installation configuration are thendisplaced such that the seat surface 44 of the buffer member 22 engagesthe seat portion 90 of the guide member 28. Because the secondinstallation unit is in the pre-installation configuration (i.e., thebuffer member 22 is in the open configuration), the seat portion 90 maypass between the fingers 32 of the buffer member 22. With the seatportion 90 engaged with the seat surface 44, the alignment portion 92 ofthe guide member 28 is within the alignment cavity 46. In addition,after the seat portion 90 is engaged with the seat surface 44, thesleeve member 26 is displaced to place the second installation unit inthe installation configuration (i.e., the buffer member 22 is in theclosed configuration). At this point, the seat portion 90 is arrangedwithin the buffer chamber 66.

With the second installation unit in the installation configuration andthe seat portion 90 of the guide member 28 within the buffer chamber 66of the buffer member 22, the first example reconditioning system 20 isin a use configuration. In the use configuration, axial rotation of thedrive member 24 causes axial rotation of the buffer member 22. Ingeneral, axial rotation of the buffer member 22 causes the implant beingreconditioned to be abraded. For example, the tip portions 52 of thefingers 32 may abrade the implant directly and/or the tip portions 52may cause an abrasive material to abrade the implant indirectly.Examples of the abrasion process will be described in further detailbelow.

In addition, when the example system 20 is in the use configuration, thedrive passageway 76 is aligned with the buffer passageway 48, and thebuffer passageway 48 is in turn aligned with the first guide passageway96. The first example reconditioning system 20 thus forms an irrigationpassageway that extends through the drive passageway 76, the bufferpassageway 48, the first guide passageway 96, and second guidepassageway(s) 98. Accordingly, irrigation fluid may be forced throughthe irrigation passageway and into the buffer chamber 66 as the buffermember 22 is rotated. The irrigation fluid may cool the variouscomponents of the system 20 and/or the implant being reconditioned; theirrigation fluid may also carry away waste material from thereconditioning process. In particular, fluid through the buffer chamber66 may flow to the exterior of the buffer member 22 through the bufferopening 68 and, under certain circumstances, between the fingers 32.

III. Second Example Reconditioning System

Referring initially to FIGS. 6-11 of the drawing, depicted therein is asecond example implant reconditioning system 120 constructed inaccordance with, and embodying, the principles of the present invention.The second example system 120 comprises a buffer member 122, a drivemember 124, a sleeve member 126, and a guide member 128. The secondexample implant reconditioning system 120 defines a second system axisB.

In use, the guide member 128 supports the buffer member 122 in a desiredposition relative to an implant to be reconditioned (not shown in FIGS.6-11). The driver member 124 engages the buffer member 122 and rotatesthe buffer member 122 relative to the implant. The sleeve member 126 isdisengaged to allow the buffer member 122 to be placed in an openconfiguration to facilitate arrangement of the buffer member 122 in thedesired position; the sleeve member 126 is then placed in an engagedposition to hold the buffer member 122 is a closed configuration aroundthe implant. As the buffer member 122 is held in the closedconfiguration around the implant and rotated relative thereto, thebuffer member 122 causes the implant member to be reconditioned.

FIGS. 7A-7D illustrate that the second example buffer member 122comprises a base portion 130 and a plurality (two or more) of fingers132 and defines a buffer member axis B₁.

The buffer member 122 is configured such that the fingers 132 can bemoved between a closed configuration (FIGS. 7A, 7C, 7D) and an openconfiguration (FIG. 7B). Typically, the entire buffer member 122 is madeof a resilient material that can be deformed to move the fingers 132between the open and closed configurations.

A drive boss 140 extends from the base portion 130 generally along thebuffer member axis B₁. As perhaps best shown in FIG. 12D, the drive boss140 is longer in a second lateral direction than in a second lateraldimension; the exact shape of the drive boss 140 is, however, notcritical so long as it functions to transfer torque as described below.

An interior surface 142 of the base portion 130 defines a seat surface144. The seat surface 144 is generally circular and symmetricallyarranged about the buffer member axis B₁.

The fingers 132 comprise extension portions 150 and tip portions 152.Formed on an outer surface 154 of the buffer member 122 are a stepsurface 156 (at the base of the fingers 132) and sleeve detent(s) 158(on the fingers 132 adjacent to the step surface 156).

The extension portions 150 define first inner surface portions 160,while the tip portions 152 each define second inner surface portions162. Extending from the second inner surface portions 162 are bristles164. When the buffer member 122 is in its closed configuration as shownin FIG. 7A, the example bristles 164 extend radially inwardly from thefingers 132 towards the buffer member axis B₁. The bristles 164 aretypically somewhat flexible and are made of or impregnated with abrasivematerial such as diamond dust capable of abrading the implant as will bedescribed in further detail below.

As perhaps best shown in FIG. 12B, the extension portions 150 have afirst length dimension L 1 and the tip portions 152 have second lengthdimensions L 2. For reasons that will become apparent from the followingdiscussion, the relative dimensions of the extension portions 150 andtip portions 152 are typically selected based on the dimensions of theimplant to be reconditioned.

As shown in FIG. 7B, with the fingers 132 define a buffer chamber 166,and the bristles 164 extend into the buffer chamber 166. In addition,gaps 168 are formed between the fingers 132 with the buffer member 122in the closed configuration. In this closed configuration, the tips ofthe bristles 164 of opposing fingers 132 are spaced from each other adistance less than a distance between the first inner surface portions160 of opposing fingers 132.

Turning now to FIGS. 8A and 8B, depicted therein are details of thesecond example drive member 124 of the second example implantreconditioning system 120. The example drive member 124 comprises anelongate shaft 170 defining a drive axis B₂. The drive member 124further defines a base cavity 172, and a boss cavity 174. The basecavity 172 is substantially symmetrically arranged along the drive axisB₂. Like the drive boss 140, the boss cavity 174 is longer in onelateral direction than in another lateral dimension. Further like thedrive boss 140, the exact shape of the boss cavity 174 is not critical.Although the exact shapes of the drive boss 140 and boss cavity 174 arenot important, the boss cavity 174 should receive the drive boss 140such that axial rotation of the drive member 124 is efficientlytransferred to the buffer member 122 as will be described in furtherdetail below.

Turning now to FIGS. 9A and 9B of the drawing, depicted in more detailtherein is the second example sleeve member 126 of the second exampleimplant reconditioning system 120. The sleeve member 126 defines a driveaxis B₃ and an interior wall 180; the interior wall 180 in turn definesa sleeve passageway 182. Formed in the interior wall 180 towards one endof the sleeve passageway 182 is a detent groove 184.

FIG. 10 depicts the guide member 128 of the second example implantreconditioning system 120. The example guide member 128 defines a guideaxis B₄ and comprises a seat portion 190 and an anchor portion 192. Theseat portion 190 is sized and dimensioned to engage the seat surface 144of the buffer member 122. The example anchor portion 192 is threaded toengage the implant to be reconditioned as will be described in furtherdetail below.

FIG. 11 depicts an alternative guide member 128 a that may be used bythe second example implant reconditioning system 120 instead of theguide member 128. The example guide member 128 a defines a guide axis B₅and comprises a seat portion 194 and an anchor portion 196. The seatportion 194 is sized and dimensioned to engage the seat surface 144 ofthe buffer member 122. As will be described in further detail below, theexample anchor portion 196 is not threaded, but instead is press fitinto the implant to be reconditioned.

The second example implant reconditioning system 120 is assembledgenerally as follows. The anchor portion 192 of the guide member 128 isengaged with the implant, and the buffer member 122 is attached to thedrive member 124 to form a first installation unit. The firstinstallation unit is then attached to the sleeve member 126 to form asecond installation unit. The second installation unit is then attachedto the guide member 128 supported by the implant.

More specifically, to attach the buffer member 122 to the drive member124, the buffer member 122 and drive member 124 are arranged such thatthe buffer axis B₁ and drive axis B₂ are aligned with each other. Thebuffer member 122 is then displaced relative to the drive member 124such that the base portion 130 of the buffer member 122 is inserted intothe base cavity 172 of the drive member 124. When the base portion 130is fully received within the base cavity 172, the drive boss 140 is alsoreceived within the boss cavity 174. Additionally, a proximal end 124 bof the drive member 124 engages the step surface 156 when the baseportion 130 is completely received within the base cavity 172. At thispoint, the second installation unit is formed.

After the buffer member 122 has been attached to the drive member 124,the sleeve member 126 is arranged such that the sleeve axis A₃ isaligned with the buffer axis B₁ and the drive axis B₂. The buffer member122 and drive member 124 are then displaced such that the distal end 124a of the drive member 124 enters the sleeve passageway 182. The buffermember 122 and the drive member 124 are inserted through the sleevepassageway 182 until the distal end 124 a exits the passageway 182 andthe detent groove 184 is generally aligned with the base portion 130 ofthe buffer member 122. At this point, the second installation unit hasbeen formed.

The second installation unit is initially in a pre-installationconfiguration in which the buffer member 122 is in the openconfiguration. By displacing the sleeve member 126 relative to thebuffer member 122 such that the sleeve detent(s) 158 enter the detentgroove 184, the second installation unit may be placed into aninstallation configuration.

The buffer member 122, drive member 124, and sleeve member 126 formingthe second installation unit in the pre-installation configuration arethen displaced such that the seat surface 144 of the buffer member 122engages the seat portion 190 of the guide member 128. Because the secondinstallation unit is in the pre-installation configuration (i.e., thebuffer member 122 is in the open configuration), the seat portion 190may pass between the fingers 132 of the buffer member 122. In addition,after the seat portion 190 is engaged with the seat surface 144, thesleeve member 126 is displaced to place the second installation unit inthe installation configuration (i.e., the buffer member 122 is in theclosed configuration). At this point, the seat portion 190 is arrangedwithin the buffer chamber 166.

With the second installation unit in the installation configuration andthe seat portion 190 of the guide member 128 within the buffer chamber166 of the buffer member 122, the second example reconditioning system120 is in a use configuration. In the use configuration, axial rotationof the drive member 124 causes axial rotation of the buffer member 122.In general, axial rotation of the buffer member 122 causes the implantbeing reconditioned to be abraded. For example, the bristles 164extending from the fingers 132 may abrade the implant directly and/ormay cause an abrasive material to abrade the implant indirectly.Examples of the abrasion process will be described in further detailbelow.

Unlike the first example implant reconditioning system 20, the secondexample implant reconditioning system 120 does not comprise interiorpassageways that form an irrigation passageway. Accordingly, if used,irrigation fluid is sprayed into the buffer chamber 166 from an externallocation as the buffer member 122 is rotated. An externally sprayedirrigation fluid may both cool the various components of the system 120and/or the implant being reconditioned and carry away waste materialfrom the reconditioning process. In particular, externally sprayed fluidwill flow into the buffer chamber 166 through the gaps 168 between thefingers 132.

IV. First Example Reconditioning Method

Referring now to FIGS. 12-18 of the drawing, depicted therein is a firstexample implant member 220 to be reconditioned. The example implantmember 220 secures a prosthetic tooth (or teeth) 222 to a jawbone 224and through soft tissue 226 in a desired orientation within a patient'smouth.

FIGS. 13 and 14 of the drawing illustrate that the example implantmember 220 extends from the jawbone 224 through the soft tissue 226.FIGS. 13 and 14 also show that the implant member 220 defines an implantaxis C and comprises a head portion 230, a shaft portion 232, and a bore234 extending along the implant axis C through the head portion 230 andthe shaft portion 232. The implant member 220 further defines an outersurface 240, an upper surface 242, and a bore surface 244. The examplebore surface 244 is threaded.

FIGS. 13 and 14 further show that a texture layer 250 is formed on theouter surface 240 of the example implant member 220. FIGS. 13 and 14further show that an interface region 252 at which the outer surface 240is adjacent to the jawbone 224 and/or soft tissue 226. Under someconditions, anomalies can develop over time within the interface region252. In particular, a comparison of FIGS. 13 and 14 illustrate that ananomaly 254 is present within the interface region 252 in FIG. 14 andthat no anomaly 254 is presented within the interface region 252 in FIG.13. Typically, FIG. 13 represents the state of the interface region 252at an earlier point in time than that depicted in FIG. 14.

Referring now to FIGS. 15 and 16, depicted at 220 therein is an examplemethod of using the first example implant reconditioning system 20 torecondition the implant member 220.

Initially, a portion of the soft tissue 226 is displaced to facilitateaccess to the head portion 230 and part of the shaft portion 232 of theimplant member 220. Then, a trephine or similar tool (not shown) mayoptionally be used in a generally conventional manner to remove, ifnecessary, a portion of the jawbone 224 and expose more of the shaftportion 232 and thus the outer surface 240 of the implant member 220.

At this point, the guide member 28 is arranged such that the shaftportion 94 thereof engages the bore 234. In the example method depictedin FIGS. 12-18, both the bore surface 244 and the shaft 94 are providedwith matching threads, so the guide member 28 is rotated about its axisA₁ to secure the guide member to the implant member 220.

The first example reconditioning system 20 is also provided and arrangedas the second installation unit in the pre-installation configuration.In this pre-installation configuration, the buffer member 22 is in theopen configuration.

At this point, an abrasive material 260 (FIG. 17) may be applied to thebuffer member 22 and, in particular, to the buffer surfaces 60 a, 62 a,and 64 a of the fingers 32. The abrasive material 260 is any materialsuitable for use in an oral environment that is capable of removing thetexture layer 250 when displaced by the buffer member 22 as describedherein. Typically, the abrasive material 260 comprises an abrasive agentsuch as pumice and/or diamond powder. Other materials may be provided tosuspend the active abrasive agent in a paste or powder appropriate foruse as described herein and to facilitate the function of the abrasiveagent.

The reconditioning system 20 is then displaced such that, as shown inFIG. 16, the head portion 230 is within the buffer chamber 66 and thetip portions 52 of the fingers 32 are adjacent to the exposed shaftportion 232. At this point, the seat portion 90 of the guide member 28engages the seat surface 44 of the buffer member 22 to support thebuffer member 28 in a desired relationship with the implant member 220.As described above, with the seat portion 90 in contact with the seatsurface 44, the irrigation passageway is formed.

With the buffer member 28 in this desired relationship, the buffersurfaces 60 a, 62 a, and 64 a defined by the fingers 32 are adjacent toalmost the entire portion of the outer surface 240 of the implant member220 that is not below the surface of the jawbone 224. FIG. 17illustrates that the abrasive material 260 is arranged between thebuffer surfaces 60 a, 62 a, and 64 a and the outer surface 240. Theexample reconditioning system 20 in the form of the second installationunit is then placed into the installation configuration; at this point,the buffer member 22 is in its closed configuration, and the headportion 230 of the implant member 220 is held within the buffer chamber66 to inhibit movement of the buffer surfaces 60 a, 62 a, and 64 a awayfrom the outer surface 240 of the implant member 220.

At this point, the drive member 24 is caused to rotate about its axis A₂(which is aligned with the system axis A) as shown in FIG. 16. Axialrotation of the drive member 24 causes the buffer member 22 to rotateabout the system axis A relative to the implant member 220. Rotation ofthe buffer member 22 in turn forces the abrasive material 260 to againstthe portion of the outer surface 240 not below the surface of thejawbone 224. In this example of the present invention, then, it is notnecessary for the buffer surfaces 60 a, 62 a, and 64 a to come intodirect contact with the outer surface 240 to abrade this surface 240.

In the example reconditioning system 20, irrigation fluid such as wateris forced along the irrigation passageway. This fluid flows through thebuffer chamber 66 and around the head portion 230 and shaft portion 232of the implant member 220. Friction from the abrading process can causethe components of the reconditioning system 20 and the implant member220 to heat up, and the irrigation fluid can reduce the build-up of suchheat. Additionally, the abrading process can create waste material, andthe irrigation fluid can remove such waste material.

After a period of time, rotation of the example reconditioning system 20is ceased, and the system 20 is placed in the pre-installationconfiguration, thereby placing the buffer member 22 back into its openconfiguration. The example reconditioning system 20 may then be removedfrom the implant 220. If the surface 240 has been abraded sufficientlyto remove a desired portion of the texture layer 250, the guide member28 may also be removed from the implant 220. If not, more abrasivematerial may be applied to the buffer member 22, and at least a portionof the process described above may be repeated.

After the desired portion of the texture layer 250 is abraded asdescribed above, the implant member 220 will appear as depicted in FIG.18. In particular, at least a portion of the texture layer 250 has beenremoved. At this point, the soft tissue 226 can be replaced and theprosthesis 222 may be reattached to the implant member 220.

As described above and depicted in FIGS. 16 and 17, the various abradingsurfaces 60 a, 62 a, and 64 a defined by the buffer member 22 define ashape that generally corresponds to the shape and dimensions of theexample implant member 220. For an implant member having different shapeand dimensions, a different buffer member 22 may be used. Thus buffermembers of various dimensions, such as the thickness dimensions T 1 andT 2 and length dimensions L 1, L 2, and L 3, are provided for use withthe typical implant reconditioning system of the present invention.

Accordingly, the first example method described herein will typicallycomprise the step of selecting a selected buffer member from a pluralityof buffer members based on the dimensions of the implant member to bereconditioned and the dimensions of the plurality of buffer members.This step will typically be performed before the step of forming thefirst installation unit.

V. Second Example Reconditioning Method

Referring now to FIGS. 19 and 20 of the drawing, depicted therein is asecond example implant member 320 to be reconditioned. The exampleimplant member 320 secures an abutment member 322 and a prosthetic tooth(or teeth) 324 to a jawbone 326 and through soft tissue 328 in a desiredorientation within a patient's mouth.

FIG. 19 of the drawing illustrates that the example implant member 320extends from the jawbone 326 through the soft tissue 328. FIG. 19 alsoshows that the implant member 320 defines an implant axis D andcomprises a head portion 330, a shaft portion 332, and a bore 334extending along the implant axis D through the head portion 330 and theshaft portion 332. The implant member 320 further defines an outersurface 340, an upper surface 342, and a bore surface 344. The examplebore surface 344 is threaded.

A texture layer (not identified in FIG. 19) is formed on the outersurface 340 of the example implant member 320. As with the implantmember 220 described above, under some conditions anomalies can developover time within an interface region where the texture layer 350interfaces with the jawbone 326 and the soft tissue 328.

Referring now to FIG. 20, depicted therein is an example method of usingthe second example implant reconditioning system 120 to recondition theimplant member 320.

Initially, a portion of the soft tissue 328 is displaced to facilitateaccess to the head portion 330 and part of the shaft portion 332 of theimplant member 320. Then, a trephine or similar tool (not shown) mayoptionally be used in a generally conventional manner to remove, ifnecessary, a portion of the jawbone 326 and expose more of the shaftportion 332 and thus the outer surface 340 of the implant member 320.

At this point, the guide member 128 is arranged such that the shaftportion 192 thereof engages the bore 334. In the example method depictedin FIGS. 19-20, both the bore surface 344 and the shaft 192 are providedwith matching threads, so the guide member 128 is rotated about its axisB₁ to secure the guide member 128 to the implant member 320.Alternatively, the guide member 128 a may be used in place of the guidemember 128. In this case, the shaft portion 196 of the guide member 128a is simply pressed into the bore 334 to secure the guide member 128 ato the implant member 320.

The second example reconditioning system 120 is also provided andarranged as the second installation unit in the pre-installationconfiguration. In this pre-installation configuration, the buffer member122 is in the open configuration. At this point, an abrasive materialsuch as the abrasive material 260 described above may optionally beapplied to the buffer member 122 and, in particular, to the innersurface portions 162 and/or bristles 164 of the fingers 132.

The reconditioning system 120 is then displaced such that, as shown inFIG. 20, the head portion 330 is within the buffer chamber 166 and thebristles 164 of the fingers 132 are adjacent to the exposed shaftportion 332. At this point, the seat portion 190 of the guide member 128engages the seat surface 144 of the buffer member 128 to support thebuffer member 128 in a desired relationship with the implant member 320.

With the buffer member 128 in this desired relationship, the innersurfaces 160 defined by the fingers 132 and bristles 164 extending fromthese fingers 132 are adjacent to almost the entire portion of the outersurface 340 of the implant member 320 that is not below the surface ofthe jawbone 326. If used, the abrasive material is arranged between thebuffer surfaces 160 and the implant outer surface 340.

The example reconditioning system 120 in the form of the secondinstallation unit is then placed into the installation configuration; atthis point, the buffer member 122 is in its closed configuration, andthe head portion 330 of the implant member 320 is held within the bufferchamber 166 to inhibit movement of the buffer surfaces 160 away from theouter surface 340 of the implant member 320.

At this point, the drive member 124 is caused to rotate about its axisB₂ (which is aligned with the system axis B) as shown in FIG. 20. Axialrotation of the drive member 124 causes the buffer member 122 to rotateabout the system axis B relative to the implant member 320. Rotation ofthe buffer member 122 in turn forces the bristles 164 and the abrasivematerial, if used, against the portion of the outer surface 340 notbelow the surface of the jawbone 326.

In the example reconditioning system 120, no irrigation passageway isprovided, so irrigation fluid such as water is sprayed into the bufferchamber 166 through the gaps 168 formed between the fingers 132. Thisfluid flows through the buffer chamber 166 and around the head portion330 and shaft portion 332 of the implant member 320. Friction from theabrading process can cause the components of the reconditioning system120 and the implant member 320 to heat up, and the irrigation fluid canreduce the build-up of such heat. Additionally, the abrading process cancreate waste material, and the irrigation fluid can remove such wastematerial.

After a period of time, rotation of the example reconditioning system120 is ceased, and the system 120 is placed in the pre-installationconfiguration, thereby placing the buffer member 122 back into its openconfiguration. The example reconditioning system 120 may then be removedfrom the implant 320. If the surface 340 has been abraded sufficientlyto remove a desired portion of the texture layer, the guide member 128may also be removed from the implant 320. If not, more abrasive materialmay be applied to the buffer member 122, and at least a portion of theprocess described above may be repeated.

After the desired portion of the texture layer is abraded as describedabove, the second example implant member 320 will exhibit an appearancesimilar to that of the first example implant member 220 as depicted inFIG. 18. In particular, at least a portion of the texture layer willhave been removed. At this point, the soft tissue 328 can be replacedand the prosthesis 324 may be reattached to the implant member 320.

As described above and depicted in FIG. 20, the abrading surfaces 160and bristles 164 of the buffer member 122 define a shape that generallycorresponds to the shape and dimensions of the example implant member320. For an implant member having different shape and dimensions, adifferent buffer member 122 may be used. Thus buffer members of variousdimensions are provided for use with the typical implant reconditioningsystem of the present invention.

Accordingly, the third example method described herein will typicallycomprise the step of selecting a selected buffer member from a pluralityof buffer members based on the dimensions of the implant member to bereconditioned and the dimensions of the plurality of buffer members.This step will typically be performed before the step of forming thefirst installation unit.

VI. Third Example Reconditioning System

Referring now to FIG. 21 of the drawing, depicted therein is a thirdexample implant reconditioning system 420 constructed in accordancewith, and embodying, the principles of the present invention. Theexample system 420 comprises a buffer member 422, a drive member 424, asleeve member 426, and a guide member 428. The example implantreconditioning system 420 defines a system axis A.

In use, the guide member 428 supports the buffer member 422 in a desiredposition relative to an implant to be reconditioned (not shown in FIG.21). The driver member 424 engages the buffer member 422 and rotates thebuffer member 422 relative to the implant. The sleeve member 426 isdisengaged to allow the buffer member 422 to be placed in an openconfiguration in which the buffer member 422 may be arranged in thedesired position; the sleeve member 426 is then placed in an engagedposition to hold the buffer member 422 is a closed configuration aroundthe implant. As the buffer member 422 is held in the closedconfiguration around the implant and rotated relative thereto, thebuffer member 422 causes the implant member to be reconditioned.

The example buffer member 422 comprises a base portion 430 and aplurality (two or more) of fingers 432 and defines a buffer member axisA₁.

The example buffer member 422 comprises a base material 434 coatedand/or at least partly embedded with an abrasive material 436. The basematerial 434 may be any material that is capable of being machined ormolded to form the buffer member 422 as described herein and holdingthat basic shape while axially rotated at speeds sufficient to abradethe implant as discussed herein. The base material 434 should also besufficiently resilient to allow the example buffer member 422 to bedeformed as described below.

While the base material 434 itself may have some abrasive or scrubbingproperties, the abrasive material 436 will typically be more abrasiveand will remove more of the undesired portion of the implant. The basematerial 434 of the example buffer member 422 is embedded with theabrasive material 436 so that, if and when the base material 434 wearsaway, more abrasive material 436 is exposed to abrade the implant.Example abrasive materials include industrial diamond particles and/orsilicon carbide, but any material capable of abrading an implant asdescribed herein may be used in addition or instead as the abrasivematerial 436. And as described above, a slurry containing abrasivematerial may be used in conjunction with the buffer member 422 toenhance the abrasion of the implant.

A drive boss 440 extends from the base portion 430 generally along thebuffer member axis A₁. The drive boss 440 is longer in a first lateraldirection than in a second lateral dimension; the exact shape of thedrive boss 440 is, however, not critical so long as it functions totransfer torque as described below.

An interior surface 442 of the base portion 430 defines a seat surface444. The seat surface 444 is generally circular and symmetricallyarranged about the buffer member axis A₁.

The fingers 432 comprise extension portions 450 and tip portions 452.Formed on an outer surface 454 of the buffer member 422 are a stepsurface 456 (at the base of the fingers 432) and sleeve detent(s) 458(on the tip portions 452 of the fingers 432).

The extension portions 450 define first inner surface portions 460,while the tip portions 452 define second and third inner surfaceportions 462 and 464. The second surface portions 462 extend between thefirst and third inner surface portions 460 and 464 of each of thefingers 432.

The extension portions 450 have a first thickness dimension t1 and afirst length dimension l1 and the tip portions 452 have a secondthickness dimension t2 and a second and third length dimensions l2 andl3. For reasons that will become apparent from the following discussion,the relative dimensions of the extension portions 450 and tip portions452 are typically selected based on the dimensions of the implant to bereconditioned.

The buffer member 422 is configured such that the fingers 432 can bemoved between an open configuration and a closed configuration.Typically, the entire buffer member 422 is made of a resilient materialthat can be deformed to move the fingers 432 between the open and closedconfigurations.

With the example buffer member 422 in the closed configuration, thefirst, second, and third inner surface portions 460, 462, and 464 arearranged to define substantially contiguous first, second, and thirdbuffer surfaces, respectively, and these buffer surfaces define a bufferchamber 466. In addition, the third buffer surfaces 464 defines a bufferopening 468.

In the closed configuration, the first inner surface portions 460 ofopposing fingers 432 are spaced from each other a distance greater thana distance between the third inner portions 464 of the opposing fingers432. Also, in the closed configuration the example first and third innersurface portions 460 and 464 are substantially parallel to the buffersystem axis A₁, while the second inner surface portions 462 are angledwith respect to the buffer axis A₁.

The example drive member 424 comprises an elongate shaft 470 defining adrive axis A₂. The drive member 424 further defines a base cavity 472, aboss cavity 474, and a proximal edge 476. The base cavity 472 issubstantially symmetrically arranged along the drive axis A₂. Like thedrive boss 440, the boss cavity 474 is longer in a first lateraldirection than in a second lateral dimension. Further like the driveboss 440, the exact shape of the boss cavity 474 is not critical.Although the exact shapes of the drive boss 440 and boss cavity 474 arenot important, the boss cavity 474 should receive the drive boss 440such that axial rotation of the drive member 424 is efficientlytransferred to the buffer member 422 as will be described in furtherdetail below.

The example sleeve member 426 defines a drive axis A₃ and an interiorwall 480; the interior wall 480 in turn defines a sleeve passageway 482.Formed in the interior wall 480 towards one end of the sleeve passageway482 is a detent groove 484. The sleeve member 426 defines a proximal endedge 486.

The example guide member 428 defines a guide axis A₄ and comprises aseat portion 490 and an anchor portion 492. The seat portion 490 issized and dimensioned to engage the seat surface 444 of the buffermember 422. The example anchor portion 492 is threaded to engage theimplant to be reconditioned as will be generally described elsewhere inthis application.

The example implant reconditioning system 420 is assembled generally asfollows. The anchor portion 492 of the guide member 428 is engaged withthe implant (not shown), and the buffer member 422 is attached to thedrive member 424 to form a first installation unit. The firstinstallation unit is then attached to the sleeve member 426 to form asecond installation unit. The second installation unit is then placedover a portion of the guide member 428 supported by the implant.

To attach the buffer member 422 to the drive member 424, the buffermember 422 and drive member 424 are then arranged such that the bufferaxis A₁ and drive axis A₂ are aligned with each other. The buffer member422 is then displaced relative to the drive member 424 such that thebase portion 430 of the buffer member 422 is inserted into the basecavity 472 of the drive member 424. When the base portion 430 is fullyreceived within the base cavity 472, the drive boss 440 is also receivedwithin the boss cavity 474. Additionally, the proximal end edge 476 ofthe drive member 424 engages the step surface 456 when the base portion430 is completely received within the base cavity 472. At this point,the first installation unit is formed.

After the buffer member 422 has been attached to the drive member 424,the sleeve member 426 is arranged such that the sleeve axis A₃ isaligned with the buffer axis A₁ and the drive axis A₂. The buffer member422 and drive member 424 are then displaced such that the distal end 424a of the drive member 424 enters the sleeve passageway 482.

The second installation unit is initially in a pre-installationconfiguration in which the buffer member 422 is in the openconfiguration. By displacing the sleeve member 426 relative to thebuffer member 422 such that the sleeve detent(s) 458 enter the detentgroove 484, the second installation unit may be placed into aninstallation configuration.

The buffer member 422, drive member 424, and sleeve member 426 formingthe second installation unit in the pre-installation configuration arethen displaced such that the seat portion 490 is within the bufferchamber 466. Because the second installation unit is in thepre-installation configuration (i.e., the buffer member 422 is in theopen configuration), the seat portion 490 may pass between the fingers432 of the buffer member 422. After the seat portion 490 is arrangedwithin the buffer chamber 466, the sleeve member 426 is displaced toplace the second installation unit in the installation configuration(i.e., the buffer member 422 is in the closed configuration). At thispoint, the seat portion 490 is arranged within the buffer chamber 466such that the surface 444 may contact the seat portion 490.

With the second installation unit in the installation configuration andthe seat portion 490 of the guide member 428 within the buffer chamber466 of the buffer member 422, the example reconditioning system 420 isin a use configuration. In the use configuration, axial rotation of thedrive member 424 causes axial rotation of the buffer member 422. Ingeneral, axial rotation of the buffer member 422 causes the implantbeing reconditioned to be abraded.

For example, the tip portions 452 of the fingers 432 may abrade theimplant directly and/or the tip portions 452 may cause an abrasivematerial to abrade the implant indirectly.

The third example reconditioning system 420 is or may be used in thesame basic manner as the first and second reconditioning systems 20 and220 described above.

VII. Additional Considerations

Described above are first and second embodiments of implantreconditioning systems and first and second embodiments of methods ofreconditioning implants using the first and second implant reconditionsystems, respectively. It should be apparent that certain features ofthe first embodiment may be used in the second embodiment and thatcertain features of the second embodiment may be used in the firstembodiment. Examples of variations on the embodiments described abovemay include the following.

The first system embodiment employs a buffer chamber shaped generally toconform to the shape of the implant being reconditioned. The bufferchamber of the second system embodiment may be similarly shaped.

An irrigation passageway similar to that formed by the first systemembodiment may be incorporated into the second system embodiment, andthe first system embodiment may be configured to operate without anirrigation passageway.

The first system embodiment may be provided with bristles such as thoseof the second system embodiment.

More bristles may be provided, and these bristles may be angled asappropriate to facilitate abrading of a given implant member.

And both the first and second method embodiments may be varied to allowthe buffer member to be displaced within a short, predefined range ofmovement to facilitate abrading of the entire desired portion of theimplant outer surface.

The scope of the present invention should thus be determined by theclaims appended hereto and not the foregoing detailed description of theexample embodiments of the invention.

What is claimed is:
 1. A system for reconditioning, in situ, a dentalimplant defining an implant axis and comprising a first implant portion,a second implant portion, and an implant outer surface, where the firstimplant portion is located farther from the implant axis than the secondimplant portion, and where a texture layer is formed on at least atextured portion of the implant outer surface, comprising: a buffermember defining a buffer axis and a plurality of fingers, where thebuffer member is operable in an open configuration in which the buffermember may be placed over a portion of the implant, and a closedconfiguration in which the buffer member is in contact with the portionof the implant, each of the fingers defines an extension portion and atip portion, and when the buffer member is in the closed configuration,at least part of the tip portion is closer to the buffer axis than theextension portion; a drive member adapted to engage the buffer membersuch that rotation of the drive member is transferred to the buffermember; and abrasive material capable of abrading the implant to removeat least a portion of the implant; whereby rotation of the drive memberwith the drive member engaged with the buffer member and the buffermember in the closed configuration causes rotation of the buffer membersuch that the tip portions of the plurality of fingers of the buffermember cause the abrasive material to remove at least a portion of thetexture layer on the textured portion of implant outer surface of thesecond implant portion.
 2. A system as recited in claim 1, furthercomprising a sleeve member, where the sleeve member moves between firstand second positions relative to the buffer member, in which: the buffermember is in the open configuration when the sleeve member is in thefirst position, and the sleeve member holds the buffer member in theclosed configuration when the sleeve member is in the second position.3. A system as recited in claim 2, in which: a detent is formed on oneof the buffer member and the sleeve member; and a groove is formed onthe other of the buffer member and the sleeve member; wherein the groovereceives the detent to releasably secure the sleeve member in the secondposition.
 4. A system as recited in claim 1, further comprising a guidemember, where the guide member is detachably attached to the implant tolimit movement of the buffer member relative to the implant.
 5. A systemas recited in claim 4, in which: the guide member defines a guideportion; and the buffer member defines a seat surface; whereby the guideportion engages the seat surface to limit a depth of movement of thebuffer member relative to the implant.
 6. A system as recited in claim5, in which the guide portion and seat surface are contoured to allowmovement of a buffer member axis defined by the buffer member relativeto an implant axis defined by the implant.
 7. A system as recited inclaim 4, in which: a drive passageway is formed in the drive member; abuffer passageway is formed in the buffer member; at least one guidepassageway is formed in the guide member; and the drive passageway, thebuffer passageway, the at least one guide passageway are aligned todefine an irrigation passageway through which material may be introducedbetween the buffer member and the implant.
 8. A system as recited inclaim 1, in which the buffer member is deformable such that the fingersmove relative to the buffer axis to define the open configuration andthe closed configuration.
 9. A system as recited in claim 1, in which:each of the fingers defines first, second, and third buffer surfaces;and the third buffer surface is formed on the part of the tip portionthat, when the buffer member is in the closed configuration, ration iscloser to the buffer axis than the extension portion.
 10. A system asrecited in claim 9, in which, when the buffer member is in the closedconfiguration: the first and third buffer surfaces defined by the buffermember are substantially parallel to the buffer member axis; and thesecond buffer surface defined by the buffer member is angled withrespect to the buffer member axis.
 11. A system as recited in claim 1,in which: a drive passageway is formed in the drive member; a bufferpassageway is formed in the buffer member; and the drive passageway andthe buffer passageway are aligned to define an irrigation passagewaythrough which material may be introduced between the buffer member andthe implant.
 12. A system as recited in claim 1, in which: a drive bossis formed on the buffer member; and a boss cavity is formed in the drivemember; wherein the boss cavity receives the drive boss such that axialrotation of the drive member causes axial rotation of the buffer member.13. A system as recited in claim 1, in which the abrasive material isarranged in a slurry that is arranged between the buffer member and theimplant.
 14. A system as recited in claim 1, in which the abrasivematerial is embedded within the buffer member.
 15. A system as recitedin claim 1, in which the buffer member is coated with the abrasivematerial.
 16. A method of reconditioning, in situ within a patient'smouth, a dental implant defining an implant axis and comprising a firstimplant portion, a second implant portion, and an implant outer surface,where the first implant portion is located farther from the implant axisthan the second implant portion, and where a texture layer is formed onat least a textured portion of the implant outer surface, comprising thesteps of: removing at least one of tissue and bone to expose at least aportion of the second implant portion of the dental implant; providing abuffer member defining a buffer axis and a plurality of fingers, wherethe buffer member is operable in an open configuration in which thebuffer member may be placed over a portion of the implant, and a closedconfiguration in which the buffer member is in contact with the portionof the implant, each of the fingers defines an extension portion and atip portion, and when the buffer member is in the closed configuration,at least part of the tip portion is closer to the buffer axis than theextension portion; arranging the buffer member in the openconfiguration; displacing the buffer member such that the first implantportion passes between the tip portions of the plurality of fingers;arranging the buffer member in the closed configuration such that tipportions of the plurality of fingers are adjacent to the second implantportion; providing abrasive material capable of removing at least aportion of the implant; and rotating the buffer member such that the tipportions of the plurality of fingers cause the abrasive material toabrade the second implant portion to remove at least a portion of thetexture layer on the textured portion of implant outer surface of thesecond implant portion.
 17. A method as recited in claim 16, furthercomprising the steps of: arranging a sleeve member in a first positionrelative to the buffer member such that the buffer member be placed inthe open configuration; arranging the sleeve member in a second positionrelative to the buffer member to hold the buffer member in the closedconfiguration.
 18. A method as recited in claim 16, further comprisingthe step of detachably attaching a guide member to the implant to limitmovement of the buffer member relative to the implant.
 19. A system forreconditioning a dental implant in situ comprising: a buffer memberoperable in an open configuration in which the buffer member may beplaced over a portion of the implant, and a closed configuration inwhich the buffer member is in contact with the portion of the implant; adrive member adapted to engage the buffer member such that rotation ofthe drive member is transferred to the buffer member; a sleeve member,where the sleeve member moves between first and second positionsrelative to the buffer member; a detent formed on one of the buffermember and the sleeve member; and a groove formed on the other of thebuffer member and the sleeve member; wherein rotation of the drivemember with the drive member engaged the buffer member and the buffermember in the closed configuration causes rotation of the buffer membersuch that the buffer member abrades at least a portion of the surface ofthe implant; the buffer member is in the open configuration when thesleeve member is in the first position; the sleeve member holds thebuffer member in the closed configuration when the sleeve member is inthe second position; and the groove receives the detent to releasablysecure the sleeve member in the second position.